MicroPackS Core Facility
The Flexible Electronics Department relies on the MicroPackS Core Facility, a 660 m² space dedicated to research and development activities in micropackaging, microelectronics, and nanoelectronics. Designed in close collaboration with industry, this platform is equipped with state-of-the-art facilities, including a 220 m² Class 1000 cleanroom and a 400 m² Class 10,000 cleanroom, accessible to all department members.
Equipment and Technologies
MicroPackS is equipped with advanced infrastructure for thin film processing, including:
- Vacuum sublimation: deposition of thin films under controlled atmosphere for microelectronics applications.
- Solution deposition and inkjet printing techniques: manufacturing of flexible and printed electronic devices with high precision.
Device Characterization and Analysis
The platform has a set of specialized tools for electrical and structural characterization, allowing the evaluation of the performance and reliability of electronic components:
- Automatic test station and multiple testers for electrical evaluation.
- Scanning Electron Microscopy (SEM): high-resolution imaging of nanometric structures.
- Atomic Force Microscopy (AFM): analysis of surface properties at the nanometric scale.
- X-ray Diffraction: characterization of materials and thin films.
- Nanoindentation: measurement of mechanical properties at the microscopic scale.
- Raman Spectroscopy: identification of molecular structures and mechanical stresses in materials.
- Scanning Acoustic Microscopy: detection of internal defects and interfaces in multilayer devices.
Thanks to this Core Facility, the Flexible Electronics Department accelerates the development of new generations of flexible, stretchable, and smart electronic devices, in collaboration with leading industrial and academic partners.
IDFab Core Facility
The Intelligent, Design – Fabrication – ID-Fab Core Facility is a space dedicated to innovation in connected objects and sensitive interfaces. It brings together state-of-the-art equipment for design, prototyping, and manufacturing, thus offering a collaborative environment for researchers, companies, and students to design high value-added objects.