The Edu4Chip 2026 summer school took place this year on the Aix-Marseille-Provence campus from August 17 to 21. Five days of discovery, exchange, and hands-on practice allowed participants to gain an introduction to the chip design process.
Organised by Institut Mines Télécom (IMT) and the Edu4Chip partners, this summer school focuses on the synergy between academic learning and practical academics. As a result, each participant was able to design a logic block for an integrated circuit sent for manufacturing.
In total, 68 participants—including 51 students—benefited from a rich programme combining in-depth courses and practical workshops. This was complemented by lectures from researchers and industry professionals from prestigious institutions:
- Grenoble INP
- DTU Copenhagen
- Infineon
- KTH Stockholm
Cross-disciplinary Knowledge to Enhance Expertise
The Edu4Chip project is primarily aimed at students from partner universities enrolled in microelectronics tracks at the Master of Science in Engineering level. It aims to develop common programmes in integrated circuit design and provide students with the necessary theoretical skills and practical expertise.
By attending the courses, practical sessions, and presentations given by academics and professionals from the microelectronics sector, participants were able to acquire fundamental knowledge of integrated circuit design processes, develop their skills in tools and methodologies, and discover the latest technological advances.
They applied these new skills to collaboratively design the building blocks of a chip sent for manufacturing.
Edu4Chip is a European programme in which Mines Saint-Étienne participates alongside other European universities: the Technical University of Munich (TUM), Tampere University (Finland), the KTH Royal Institute of Technology in Stockholm, and the Technical University of Denmark (DTU).
Funded by the European Health and Digital Executive Agency (HaDEA), it is part of Horizon Europe, the European programme for research and innovation.
